1.

Conference Proceedings
Conference Proceedings
1. Electromigration Failure Modes in CU Metallization*
Gall, M. ; Capasso, C. ; Thrasher, S. ; Zhao, L. ; Muiski, P. ; Hernandez, R. ; Herrick, M. ; Angyal, M. ; Boeck, B. ; Kawasaki, H.
Pub. info.: ULSI Process Integration : proceedings of the International Symposium.  pp.410-425,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-2
2.

Conference Proceedings
Conference Proceedings
2. Process Control Challenges and Solutions: TEOS, W, and Cu CMP
Angyal, M. ; Boeck, B. ; Cope, J. ; Dang, C. ; Grudowski, P. ; Islam, R. ; Kolagunta, V. ; Mendonca, J. ; Pettinato, C. ; Selinidis, S. ; Smith, B.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.167-172,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566