1.

Conference Proceedings
Conference Proceedings
1. Hydrophobic Low Temperature Wafer Bonding; Void Formation in the Oxide-Free Interface
Amirfeiz, P. ; Sanz-Velasco, A. ; Bengtsson, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.267-277,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Wafer Bonding using Oxygen Plasma Treatment in RIE and ICP RIE
Sanz-Velasco, A. ; Amirfeiz, P. ; Bengtsson, S. ; Colinge, C.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.31-40,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27