1.

Conference Proceedings
Conference Proceedings
1. Fine Keyed Alignment and Bonding for Wafer-Level 3D Ics
Lee, Sang Hwui ; Niklaus, Frank ; McMahon, J. Jay ; Yu, Jian ; Kumar, Ravi J. ; Li, Hui-feng ; Gutmann, Ronald J. ; Cale, Timothy S. ; Lu, J-Q.
Pub. info.: Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A..  pp.433-438,  2006.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 914
2.

Conference Proceedings
Conference Proceedings
2. Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate
Yu, Jian ; Moore, Richard L. ; Lee, Sang Hwui ; McMahon, J. Jay ; Lu, Jian-Qiang ; Gutmann, Ronald J.
Pub. info.: Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A..  pp.427-432,  2006.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 914
3.

Conference Proceedings
Conference Proceedings
3. The Experimental Research on Tiled Multiple Projectors Displaying Based on ICC Mechanism
Liu, Zhen ; Zhu, Ming ; Yu, Jian
Pub. info.: Advances in printing and packaging technologies : selected, peer reviewed papers from the 2nd China Academic Conference on Printing and Packaging (CACPP 2012), October 19-20, 2012, Beijing, China.  pp.80-85,  2013.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Applied mechanics and materials
Ser. no.: 262
4.

Conference Proceedings
Conference Proceedings
4. Phase transformation and Raman spectra in BaTiO3 nanocrystals
Yu, Jian ; Meng, X.J. ; Sun, J.L. ; Wang, G.S. ; Chu, J.H.
Pub. info.: Perovskite materials : symposium held April 1-5, 2002, San Francisco, California, U.S.A..  pp.177-182,  2002.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 718
5.

Conference Proceedings
Conference Proceedings
5. Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding
Yu, Jian ; Wang, Yinmin ; Haberl, Arthur W. ; Bakhru, Hassa ; Lu, Jian-Qiang ; Gutmann, Ronald J.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.387-392,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863
6.

Conference Proceedings
Conference Proceedings
6. Effect of Substrate Orientation on the Growth Rate and Surface Morphology on GaSb Grown by Metal-organic Vapor Phase Epitaxy
Yu, Jian ; Bhat, Ishwara B.
Pub. info.: Semiconductor defect engineering - materials, synthetic structures and devices : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.51-58,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 864