1.

Conference Proceedings
Conference Proceedings
1. Effect of Aluminum and Titanium Content on Grain Growth, Texture and Magnetic Properties in 3%Si Non-Oriented Electrical Steel
Y. Arita ; Y. Ushigami
Pub. info.: THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada.  539-543  pp.4428-4433,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 539-543(5)
2.

Conference Proceedings
Conference Proceedings
2. Texture Change during Grain Growth in Non-Oriented Electrical Steel
Y. Arita ; L. Chan ; S.D. Sintay ; A.D. Rollett
Pub. info.: Recrystallization and grain growth IV : selected peer reviewed papers from the Fourth International Conference on Recrystallization and Grain Growth (ReX & GG 2010), July 4-9, 2010, Sheffield, U.K..  pp.33-40,  2012.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 715-716
3.

Conference Proceedings
Conference Proceedings
3. Orientation Selectivity of Secondary Recrystallization in Grain-Oriented Silicon Steel
Y. Ushigami ; Y. Arita ; K. Ushioda
Pub. info.: Recrystallization and Grain Growth V : Selected, peer reviewed papers from the 5th International Conference on Recrystallization and Grain Growth (ReX&GG V), May 5-10, 2013, Sydney, Australia.  pp.337-340,  2013.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 753
4.

Conference Proceedings
Conference Proceedings
4. Texture Change during Grain Growth in Non-Oriented Electrical Steel
Y. Arita ; Y. Ushigami ; K. Murakami ; K. Ushioda
Pub. info.: Recrystallization and Grain Growth V : Selected, peer reviewed papers from the 5th International Conference on Recrystallization and Grain Growth (ReX&GG V), May 5-10, 2013, Sydney, Australia.  pp.329-332,  2013.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 753
5.

Conference Proceedings
Conference Proceedings
5. Fine Copper Pattern Formation Using RIE with a siCl4, N2, Cl2, and NH3 Mixture and its Eleclromigration Characteristics
K. Ohno ; M. Sato ; Y. Arita
Pub. info.: Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials.  pp.316-325,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-25