1.

Conference Proceedings
Conference Proceedings
1. Buried Passives used with Thick-Film Processes on Alumina for High Frequency Applications
Wu,Randy ; Chi,Major ; Wu,Ken ; Hyatt,Fred ; Tseng,Bin-Chyi
Pub. info.: Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California.  pp.245-250,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4428
2.

Conference Proceedings
Conference Proceedings
2. ACTIVE PIXEL SENSOR(APS)PACKAGE
Hyatt,Frederick R. ; Lu,Brian ; Wu,Ken ; Lin,David ; Lehtonen,Carl ; Petit,Ray
Pub. info.: 1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado.  pp.175-178,  1999.  Reston, VA.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3830