1.

Conference Proceedings
Conference Proceedings
1. MOISTURE ABSORPTION AND ITS EFFECTS ON THE PERFORMANCE OF PRINTED CIRCUIT MATERIALS
Liu, P. C. ; Wang, D. W. ; Fuerniss, S. J. ; Poliks, M. D. ; Obrzut, J. ; Siperko, L. M. ; Chen, W. T. ; Havens, R. D. ; Murcko, R. M.
Pub. info.: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.309-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 323
2.

Technical Paper
Technical Paper
2. Dynamics and Active Control of Largely Deflected Active Structures Using the Finite Element Technique.
Wang, D. W. ; Tzou, H. S. ; Arnold, S. M. ; Lee, H-J.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003
3.

Technical Paper
Technical Paper
3. Control of Static Shape, Dynamic Oscillation, and Thermally Induced Vibration of Nozzles.
Wang, D. W. ; Tzou, H. S. ; Arnold, S. M.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003