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12 results

Conference Proceedings

1. Finite Element Modeling of Grain Aspect Ratio and Strain Energy Density in a Textured Copper Thin Film

Vinci, R. P. ; Bravman, J. C.

Pub. info.:	Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A.. pp.481-, 1996. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	428

Conference Proceedings

2. Observations of Low-Cycle Fatigue of Al Thin Films For MEMS Applications

Cornella, G. ; Vinci, R. P. ; Iyer, R. Suryanarayanan ; Dauskardt, R. H. ; Bravman, J. C.

Pub. info.:	Microelectromechanical structures for materials research : symposium held April 15-16, 1998 , San Francisco, California, U.S.A.. pp.81-, 1998. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	518

Conference Proceedings

3. Simulation of the Effect of Dielectric Air Gaps on Interconnect Reliability

Bassman, L. C. ; Vinci, R. P. ; Shieh, B. P. ; Kim, D-K. ; McVittie, J. P. ; Saraswat, K. C. ; Deal, M. D.

Pub. info.:	Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.. pp.323-, 1997. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	473

Conference Proceedings

4. EFFECT OF COPPER FILM THICKNESS ON STRESS AND STRAIN IN GRAINS OF DIFFERENT ORIENTATION

Vinci, R. P. ; Zielinski, E. M. ; Bravman, J. C.

Pub. info.:	Thin films, stresses and mechanical properties V : symposium held November 28-December 2, 1994, Boston, Massachusetts, U.S.A.. pp.459-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	356

Conference Proceedings

5. INFLUENCE OF A CAPPING LAYER ON THE MECHANICAL PROPERTIES OF COPPER FILMS

Keller, R. -M. ; Bader, S. ; Vinci, R. P. ; Arzt, E.

Pub. info.:	Thin films, stresses and mechanical properties V : symposium held November 28-December 2, 1994, Boston, Massachusetts, U.S.A.. pp.453-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	356

Conference Proceedings

6. Finite Element Modeling of Grain Aspect Ratio and Strain Energy Density in a Textured Copper Thin Film

Vinci, R. P. ; Bravman, J. C.

Pub. info.:	Thin films, stresses and mechanical properties VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A.. pp.411-, 1997. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	436

Conference Proceedings

7. A Simple Analysis of Average Mechanical Behavior and Strain Energy Density of Misoriented Grains in a Textured Film

Vinci, R. P. ; Weihs, T. P. ; Zielinski, E. M. ; Barbee, T. W., Jr. ; Bravman, J. C.

Pub. info.:	Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.. pp.97-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	391

Conference Proceedings

8. The Influence of Strain Energy Minimization on Abnormal Grain Growth in Copper Thin Films

Zielinski, E. M. ; Vinci, R. P. ; Bravman, J. C.

Pub. info.:	Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.. pp.103-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	391

Conference Proceedings

9. High surface area substrates for DNA arrays

Glazer, M. ; Frank, C. ; Vinci, R. P. ; McGall, G. ; Fidanza, J. ; Beecher, J.

Pub. info.:	Organic/inorganic hybrid materials II : symposium held April 5-9, 1999, San Francisco, California, U.S.A.. pp.371-, 1999. Warrendale, PA. MRS-Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	576

10.

Conference Proceedings

10. Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films

Keller, R.-M. ; Kuschke, W.-M. ; Kretschmann, A. ; Bader, S. ; Vinci, R. P. ; Arzt, E.

Pub. info.:	Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.. pp.309-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	391

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Author: Vinci, R. P.