1.

Conference Proceedings
Conference Proceedings
1. Interaction between the Electroless Copper Deposition Solution and the Low-k Fluorinated Dielectrics
Hsu, D.T. ; Tong, H.Y. ; Shi, F.G. ; Lopatin, S. ; Shacham-Diamand, Y. ; Zhao, B. ; Brongo, M. ; Vasudev, P.K.
Pub. info.: Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability.  pp.72-83,  1998.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-6
2.

Conference Proceedings
Conference Proceedings
2. SOI materials for mainstream CMOS technology
Maszara, W.P. ; Dockerty, R. ; Gondran, C. ; Vasudev, P.K.
Pub. info.: Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices.  pp.15-26,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-23
3.

Conference Proceedings
Conference Proceedings
3. Integration of Electroless Cu and CoWP Multilayers in Damascene Process
Lopatin, S. ; Shacham-Diamand, Y. ; Dubjn, V. ; Vasudev, P.K.
Pub. info.: Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues.  pp.186-195,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-8
4.

Conference Proceedings
Conference Proceedings
4. Compatibility of Low Dielectric Constant Poly (arylether) with the Electroless Copper Deposition Solution
Hsu, D. ; Iskander, M. ; Tong, H.Y. ; Shi, F. ; Lopatin, S. ; Shacham-Diamand, Y. ; Zhao, B. ; Brongo, M. ; Vasudev, P.K.
Pub. info.: Dielectric material integration for microelectronics.  pp.103-112,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-3
5.

Conference Proceedings
Conference Proceedings
5. PROCESS-INDUCED POINT DEFECTS IN OXIDEZ SILICON STRUCTURES
Caplan, P.J. ; Poindexter, E.H. ; Vasudev, P.K. ; Henderson, R.C.
Pub. info.: Science and technology of microfabrication : symposium held December 4-5, 1986, Boston, Massachusetts, U.S.A..  pp.241-246,  1987.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 76
6.

Conference Proceedings
Conference Proceedings
6. * SOLID PHASE EPITAXIAL RECRYSTALLIZATION OF SOS, WITH APPLICATIONS TO SUBMICROMETER CMOS AND BIPOLAR DEVICES
Vasudev, P.K.
Pub. info.: Semiconductor-on-insulator and thin film transistor technology : symposium held December 3-6, 1985, Boston, Massachusetts, U.S.A..  pp.121-128,  1985.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 53
7.

Conference Proceedings
Conference Proceedings
7. MATERIALS REQUIREMENTS FOR FUTURE SEMICONDUCTOR TECHNOLOGY
Seidel, T.E. ; Vasudev, P.K. ; Stanley, T.
Pub. info.: Proceedings of the Seventh International Symposium on Silicon Materials Science and Technology.  pp.947-961,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-10
8.

Conference Proceedings
Conference Proceedings
8. Conformal Electroless Copper Deposition for sub-0.5 μm Interconnect Wiring of Very High Aspect Ratio
Lopatin, S. ; Shacham-Diamond, Y. ; Dubin, V.M. ; Vasudev, P.K. ; Zhao, B. ; Pellerin, J.
Pub. info.: Proceedings of the Third Symposium on Electrochemically Deposited Thin Films.  pp.271-288,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-19