1.

Conference Proceedings
Conference Proceedings
1. High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)
Chang, G. -K. ; Guidotti, D. ; Huang, Z. R. ; Wan, L. ; Yu, J. ; Hegde, S. ; Kuo, H. -F. ; Chang, Y, -J. ; Liu, F. ; Wang, F. ; Tummala, R.
Pub. info.: Enabling photonics technologies for defense, security, and aerospace applications : 31 March-1 April 2005, Orlando, Florida, USA.  pp.176-190,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5814
2.

Conference Proceedings
Conference Proceedings
2. Nanoscale Packaging and Nano-Bio Electronic Systems
Tummala, R. ; Raj, P. M. ; Wang, Z. L.
Pub. info.: Dielectrics for nanosystems: materials science, processing, reliability, and manufacturing : proceedings of the First international symposium.  pp.1-15,  2004.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-04