1.

Conference Proceedings
Conference Proceedings
1. THE PROCESSING AND PROPERTIES OF MULTILAYER INTERCONNECTION STRUCTURES USING THERMOSET FILMS DERIVED FROM BISBENZOCYCLOBUTENE
Townsend, P.H. ; Burdeaux, D.C. ; Hahn, S.F. ; Thomsen, M. ; Carr, J.N.
Pub. info.: Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A..  pp.47-52,  1989.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 154
2.

Conference Proceedings
Conference Proceedings
2. STRESSES IN GATE LEVEL INTERCONNECTS OF WSi2 and TaSi2
Townsend, P.H. ; Fulks, R.T. ; Vander Plas, H.A. ; Ho, J.
Pub. info.: Materials issues in silicon integrated circuit processing : symposium held April 15-18, 1986, Palo Alto, California, U.S.A..  pp.395-402,  1986.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 71