1.

Conference Proceedings
Conference Proceedings
1. Process Design of Low Temperature Wafer Bonding
Tong, Q-Y. ; Goesele, U.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.78-95,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
2.

Conference Proceedings
Conference Proceedings
2. Application of Direct Bonding to the Fabrication of Si/ZnS Composite Infrared Windows
Feng, T. ; Tong, Q-Y. ; Askinazi, J. ; Goesele, U.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.597-603,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
3.

Conference Proceedings
Conference Proceedings
3. Point Defects, Diffusion, and Gettering in Silicon
Gosele, U. ; Conrad, D. ; Werner, P. ; Tong, Q-Y. ; Gafiteanu, R. ; Tan, T. Y.
Pub. info.: Defects and diffusion in silicon processing : symposium held April 1-4, 1997, San Francisco, California, U.S.A..  pp.13-,  1997.  Pittsburg, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 469
4.

Conference Proceedings
Conference Proceedings
4. Wafer bonding involving complex oxides
Alexe, M. ; Kopperschmidt, P. ; Gosele, U. ; Tong, Q-Y. ; Huang, L-J.
Pub. info.: Multicomponent oxide films for electronics : symposium held April 6-8, 1999, San Francisco, California, U.S.A..  pp.285-,  1999.  Warrendale, PA.  MRS-Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 574