1.

Conference Proceedings
Conference Proceedings
1. Automated residual metal inspection
Tiwari, R. ; Strupp, J. ; Terala, P.S. ; Shoham, D.
Pub. info.: Design, process integration, and characterization for microelectronics : 6-7 March 2002, Santa Clara, USA.  pp.72-80,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4692
2.

Conference Proceedings
Conference Proceedings
2. SPRAY FORMING OF MoSi2 AND MoSi2-BASED COMPOSITES
Tiwari, R. ; Herman, H. ; Sampath, S.
Pub. info.: High-Temperature ordered intermetallic alloys IV : symposium held November 27-30, 1990, Boston, Massachusetts, U.S.A..  pp.807-814,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 213
3.

Conference Proceedings
Conference Proceedings
3. Integration Challenges of Inorganic Low-k (k ｡？2.5) Materials With Cu for Sub-0.25 ｦﾌm Multilevel Interconnects
Yu, K. C. ; Defilippi, J. ; Tiwari, R. ; Sparks, T. ; Smith, D. ; Olivares, M. ; Selinidis, S. ; Zhang, J. ; Junker, K. ; Braekelmann, G. ; Farkas, J. ; Lee, K. S. ; Filipiak, S. ; Lindell, M. ; Watanabe, J. K. ; Wetzel, J. T. ; Jawarani, D. ; Herrick, M. T. ; Cave, N. G. ; Hobbs, C. C.
Pub. info.: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.499-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 564
4.

Conference Proceedings
Conference Proceedings
4. Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects
Blumenthal, R. ; Braekelmann, G. ; Cave, N. G. ; Conner, J. ; Crabtree, P. ; Defilippi, J. ; Denning, D. ; Farkas, J. ; Filipiak, S. ; Fowler, B. W. ; Fox, R. ; Freeman, M. ; Garcia, S. ; Herrick, M. T. ; Hershey, R. ; Hobbs, C. C. ; Jawarani, D. ; Junker, K. ; Keyes, C. ; Kirksey, S. ; Lee, J. J. ; Lee, K. S. ; Lindell, M. ; Mora, R. ; Neil, T. ; Nguyen, T. ; Olivares, M. ; Pena, T. Newton. D. ; Selinidis, S. ; Sieloff, D. D. ; Smith, D. ; Sparks, T. ; Stankus, JJ. ; Tiwari, R. ; VanGompel, T. ; Watanabe, J. K. ; Weitzman, E. J. ; Wetzel, J. T. ; Yu, K. C. ; Zhang, J.
Pub. info.: Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A..  pp.151-160,  1999.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 565
5.

Technical Paper
Technical Paper
5. Influence of Cr and W alloying on the fiber-matrix interfacial shear strength in cast and directionally solidified sapphire NiAl composites
Asthana, R. ; Tiwari, R. ; Tewari, S. N.
Pub. info.: NASA Technical Reports.  (NASA-TM-111217),  pp.1-10,  1995.  National Aeronautics and Space Adminstration