1.

Conference Proceedings
Conference Proceedings
1. Electromigration Characterization for Multilevel Metallizations Using Textured AlCu
Ting, Larry M. ; Hong, Qi-Zhong
Pub. info.: Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A..  pp.75-,  1996.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 428
2.

Conference Proceedings
Conference Proceedings
2. Effect of Via Etch Profile and Barrier Metal on Electromigration Performance of W-Filler Via Structure in TiN/AlCu/TiN Metallization
Ting, Larry M. ; Dixit, G. ; Jain, M. ; Littau, K. A. ; Tran, H. ; Chang, M. ; Sinha, A.
Pub. info.: Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A..  pp.453-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 391