1.

Conference Proceedings
Conference Proceedings
1. Gap Filling Cu Electroplating Technology for Damascend ULSI Interconnect Process
Ting, C.H. ; Zhu, M. ; Papapanayiotou, D. ; Ivanov, I.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.99-110,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
2.

Conference Proceedings
Conference Proceedings
2. Recent Advances in Gap Filling Cu Electroplating Technology*
Zhu, M. ; Papapanayiotou, D. ; Lee, Y. ; Ting, C.H.
Pub. info.: Electrochemical technology applications in electronics : proceedings of the third international symposium.  pp.38-43,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-34
3.

Conference Proceedings
Conference Proceedings
3. *ELECTROLESS COPPER DEPOSITION FOR MULTILEVEL METALLIZATION
Wong, S. Simon ; Cho, James S. ; Kang, Ho K. ; Ting, C.H.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.347-356,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
4.

Conference Proceedings
Conference Proceedings
4. 29. Fundamental Shift in ULSI Interconnect Technology - Electrochemical Deposition of Cu for on Chip Interconnects
Ting, C.H. ; Dubin, V. ; Cheung, R.
Pub. info.: Proceedings of the Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling.  pp.321-335,  1997.  Pennington, New Jersey.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-27
5.

Conference Proceedings
Conference Proceedings
5. A SEEDED CHANNEL APPROACH TO SILICON-ON-INSULATOR TECHNOLOGY
Ting, C.H. ; Baerg, W. ; Lin, H.Y. ; Siu, B. ; Hwa, T. ; Sturm, J.C. ; Gibbons, J.F.
Pub. info.: Semiconductor-on-insulator and thin film transistor technology : symposium held December 3-6, 1985, Boston, Massachusetts, U.S.A..  pp.77-82,  1985.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 53