1.

Conference Proceedings
Conference Proceedings
1. Electromigration Failure Modes in CU Metallization*
Gall, M. ; Capasso, C. ; Thrasher, S. ; Zhao, L. ; Muiski, P. ; Hernandez, R. ; Herrick, M. ; Angyal, M. ; Boeck, B. ; Kawasaki, H.
Pub. info.: ULSI Process Integration : proceedings of the International Symposium.  pp.410-425,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-2
2.

Conference Proceedings
Conference Proceedings
2. Statistical Analysis of Electromigration Lifetimes and Void Evolution for Cu Interconnects
Hauschildt, M. ; Gall, M. ; Thrasher, S. ; Justison, P. ; Michaelson, L. ; Hernandez, R. ; Kawasaki, H. ; Ho, P.S.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.379-384,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812