1.

Conference Proceedings
Conference Proceedings
1. Back-End Assembly Solution to Bare Copper Bond Pad Wafers
Lee, Chu-Chung ; Williams, Bill ; Tan, L.C. ; Downey, Susan ; Harpaer, Peter ; Harun, Fuaida ; Yong, C.C.
Pub. info.: Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001.  pp.511-514,  2001.  Washington, DC.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4587
2.

Conference Proceedings
Conference Proceedings
2. Modelling the Low-Altitude Trapped Radiation Environment
Fung, S.F. ; Boscher, D.M. ; Tan, L.C. ; Cooper, J.F.
Pub. info.: Environment modelling for space-based applications : symposium proceedings, ESTEC, Noordwijk, 18-20 September 1996.  pp.65-74,  1996.  Noordwijk, The Netherlands.  ESA Publications Division
Title of ser.: ESA SP
Ser. no.: 392