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11 results

Conference Proceedings

1. Development of the ASML EUV alpha demo tool

Romeo, C. ; Cantu, P. ; Henry, D. ; Takekoshi, H. ; Hirayanagi, N. ; Suzuki, K. ; McCallum, M. ; Fujita, H. ; Takikawa, T. ; Hoga, M.

Pub. info.:	Emerging lithographic technologies IX : 1-3 March 2005, San Jose, California, USA. pp.90-101, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5751

Technical Paper

2. Effect of Gaseous Hydrocarbon-Silicon and Load Current on Contact Resistance of Electromagnetic Relays.

Takikawa, T.

Pub. info.:	2010 SAE world congress : technical paper. 2010. Warrendale, Penn.. Society of Automotive Engineers
Title of ser.:	Society of Automotive Engineers technical paper series
Ser. no.:	2010

Technical Paper

3. Factors Influencing Contact Life and Failure Mode in Compact PCB Power Relays.

Takikawa, T.

Pub. info.:	2009 SAE world congress : technical paper. 2009. Warrendale, Penn.. Society of Automotive Engineers
Title of ser.:	Society of Automotive Engineers technical paper series
Ser. no.:	2009

Technical Paper

4. Contact Life and Switching Behavior of Compact PCB Power Relays.

Takikawa, T. ; Hargett, M.E.

Pub. info.:	2008 SAE world congress : technical paper. 2008. Warrendale, Penn.. Society of Automotive Engineers
Title of ser.:	Society of Automotive Engineers technical paper series
Ser. no.:	2008

Technical Paper

5. Load Durability Performance of Small-size Power SMD Relays.

Takikawa, T. ; Shibata, M.

Pub. info.:	2007 SAE world congress : technical paper. 2007. Warrendale, Penn.. Society of Automotive Engineers
Title of ser.:	Society of Automotive Engineers technical paper series
Ser. no.:	2007

Conference Proceedings

6. CD-measurement technique for hole patterns on stencil mask

Ishikawa, M. ; Yusa, S. ; Takikawa, T. ; Fujita, H. ; Sano, H. ; Hoga, M. ; Hayashi, N.

Pub. info.:	24th Annual BACUS Symposium on Photomask Technology. pp.1107-1116, 2004. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5567

Conference Proceedings

7. Image placement accuracy of single-membrane stencil masks for e-beam lithography [5992-162]

Kitada, M. ; Yusa, S. ; Kuwahara, N. ; Fujita, H. ; Takikawa, T. ; Sano, H. ; Hoga, M.

Pub. info.:	25th Annual BACUS Symposium on Photomask Technology. pp.59924R-, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5992

Conference Proceedings

8. 200-mm EPL stencil mask fabrication and metrology at DNP: IP and CD accuracy within subfield

Takikawa, T. ; Ishikawa, M. ; Yusa, S. ; Kinase, Y. ; Fujita, H. ; Hoga, M. ; Hayashi, N. ; Sano, H.

Pub. info.:	Emerging Lithographic Technologies VIII. pp.727-739, 2004. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5374

Conference Proceedings

9. Development of a LEEPL mask: flatness and IP measurements

Aritsuka, Y. ; Kitada, M. ; Kurosawa, M. ; Takikawa, T. ; Fujita, H. ; Sano, H. ; Hoga, M. ; Hayashi, N.

Pub. info.:	Photomask and Next-Generation Lithography Mask Technology XI. pp.941-949, 2004. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5446

10.

Conference Proceedings

10. Evaluation of image placement of EPL stencil masks

Yusa, S. ; Ishikawa, M. ; Kinase, Y. ; Takikawa, T. ; Fujita, H. ; Sano, H. ; Houga, M. ; Hayashi, N.

Pub. info.:	Photomask and Next-Generation Lithography Mask Technology XI. pp.923-931, 2004. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5446

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Author: Takikawa, T.