1.

Conference Proceedings

Conference Proceedings
H. Nishizawa ; S. Azuma ; T. Yoshitake ; H. Masuda ; M. Kawaji ; A. Anzai
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  1993-29  pp.176-188,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
2.

Conference Proceedings

Conference Proceedings
K. Hanada ; T. Nishiyama ; T. Yoshitake ; K. Nagayama
Pub. info.: THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009.  pp.1685-1690,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 638-642
3.

Conference Proceedings

Conference Proceedings
Y. Nakagawa ; T. Yoshitake ; K. Hanada ; A. Nagano ; R. Ohtani
Pub. info.: THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009.  pp.2927-2932,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 638-642
4.

Conference Proceedings

Conference Proceedings
T. Yoshida ; T. Yoshitake ; K. Sumitani ; R. Ohtani ; Y. Nakagawa
Pub. info.: THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009.  pp.2921-2926,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 638-642