1.

Conference Proceedings
Conference Proceedings
1. Development of a Wire-Bonding-Less SiC Power Module Operating over a Wide Temperature Range
S. Sato ; H. Tanisawa ; T. Anzai ; H. Takahashi ; Y. Murakami
Pub. info.: Silicon Carbide and Related Materials 2015 : [ICSCRM 2015] : selected, peer reviewed papers from the 16th International Conference on Silicon Carbide and Related Materials, October 4-9, 2015, Giardini Naxos, Italy.  pp.1066-1069,  2016.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 858
2.

Conference Proceedings
Conference Proceedings
2. Evaluation of Physical Properties on Functionally Graded Piping Joints Made from Cu and Austenitic Stainless Steel Powder
K. Nakano ; T. Anzai ; T. Yamaguchi ; K. Nishio
Pub. info.: Multiscale, multifunctional and functionally graded materials : selected, peer reviewed papers from the 10th International Symposium on MM & FGMs, 22nd-25th September 2008, Sendai, Japan.  pp.273-278,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 631-632
3.

Conference Proceedings
Conference Proceedings
3. A Point-contact-type Sandwich-structure Peltier device and Time Constant
T. Anzai ; S. Yamaguchi
Pub. info.: Student Posters (General) - 214th ECS Meeting/PRiME 2008.  pp.99-107,  2009.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(24)