1.

Conference Proceedings
Conference Proceedings
1. Superplastic Flow of Silicon Nitride-Based Nanocomposite at High Strain Rates
K. Chihara ; Y. Shinoda ; T. Akatsu ; F. Wakai
Pub. info.: Superplasticity in advanced materials : ICSAM 2006 : proceedings of the 9th International Conference on Superplasticity in Advanced Materials, 23-26 June 2006, Chengdu, P.R. China.  pp.597-600,  2007.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 551-552
2.

Conference Proceedings
Conference Proceedings
2. Highly-Strained Silicon-On-Insulator Development
T. Akatsu ; J. Hartmann ; C. Aulnette ; Y. Le Vaillant ; D. Rouchon
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.107-117,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
3.

Conference Proceedings
Conference Proceedings
3. High Temperature Internal Friction Behavior of Unidirectionally Solidified Al2O3/YAG Eutectic
S. Ueno ; S. Takata ; Y. Tanabe ; T. Akatsu ; E. Yasuda
Pub. info.: THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009.  pp.2482-2486,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 638-642