1.

Conference Proceedings
Conference Proceedings
1. New Tools and Methods for the Thermal Transient Testing of Packages
Rencz,Marta ; Farkas,G. ; Szekely,Vladimir ; Poppe,A. ; Courtois,Bernard
Pub. info.: Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California.  pp.268-273,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4428
2.

Conference Proceedings
Conference Proceedings
2. Thermal Transient Testing
Szekely,Vladimir ; Rencz,M. ; Courtois,B.
Pub. info.: 1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota.  pp.18-23,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2920