1.

Conference Proceedings
Conference Proceedings
1. High-performance Integration of Copper Interconnects with Low-k Hydrogen Silsesquioxane Employing Deuterium Plasma Treatment
Liu, P.-T. ; Chang, T.-C. ; Yang, Y.L. ; Cheng, Y.F. ; Lee, J.K. ; Shih, F.Y. ; Tsai, E. ; Chen, G. ; Sze, S.M.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.251-260,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
2.

Conference Proceedings
Conference Proceedings
2. Copper-Diffusion-Resistance Treatment by NH3 Plasma for Organic Low-k Methylsilsesquioxane/Copper Interface
Chang, T.C. ; Perng, T.H. ; Liu, P.T. ; Sze, S.M. ; Chang, C.Y.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.232-240,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
3.

Conference Proceedings
Conference Proceedings
3. Enhancement of Organic Low-k Hybrid-Organic-SiloXane-Polymer (HOSP) in Resisting Oxygen Plasma Process
Chang, T.-C. ; Liu, P.-T. ; Su, H. ; Chang, C.-F. ; Yang, Y.-L. ; Sze, S.M. ; Hou, J. ; Chung, H.
Pub. info.: Low and high dielectric constant materials : materials science, processing, and reliability issues : proceedings of the fifth international symposium.  pp.72-89,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-5
4.

Conference Proceedings
Conference Proceedings
4. Improvement in the Characteristics of Post-CMP Low-k Methylsilsesquioxane(MSQ)
Chrang, T.-C. ; Liu, P.-T. ; Huang, M.-C. ; Tsai, T.-M. ; Hsu, K.-C. ; Yang, Y.-L. ; Sze, S.M. ; Chung, H. ; Hou, J.
Pub. info.: Low and high dielectric constant materials : materials science, processing, and reliability issues : proceedings of the fifth international symposium.  pp.114-132,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-5
5.

Conference Proceedings
Conference Proceedings
5. Ammonia Plasma Passivation Effects on Properties of Post-CMP Low-k Hydrogen Silsesquioxane (HSQ)
Chang, T.-C. ; Liu, P.-T. ; Tsai, T.-M. ; Chang, C.-F. ; Yang, Y.-L. ; Sze, S.M. ; Shih, F.Y. ; Tsai, E. ; Chen, G. ; Lee, J.K.
Pub. info.: Low and high dielectric constant materials : materials science, processing, and reliability issues : proceedings of the fifth international symposium.  pp.133-143,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-5
6.

Conference Proceedings
Conference Proceedings
6. Selective Epitaxial Growth of GaInP by LP-MOCVD using Ethyldimethylindium and Triethylgallium
Chan, S.H. ; Sze, S.M. ; Chang, C.Y. ; Lee, W.I.
Pub. info.: Proceedings of the Symposium on Large Area Wafer Growth and Processing for Electronic and Photonic Devices and the twentieth State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XX).  pp.240-246,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-18