1.

Conference Proceedings
Conference Proceedings
1. Inter-and intra-die polysilicon critical dimension variation
Stine,B.E. ; Boning,D.S. ; Chung,J.E. ; Bell,D.A. ; Equi,E.
Pub. info.: Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II.  pp.27-35,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2874
2.

Conference Proceedings
Conference Proceedings
2. Evaluation of pad life in chemical mechanical polishing process using statistical metrology
Muthukrishnan,N.M. ; Prasad,S. ; Stine,B.E. ; Loh,W. ; Nagahara,R. ; Chung,J.E. ; Boning,D.S.
Pub. info.: Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III.  pp.70-79,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3216