1.

Conference Proceedings
Conference Proceedings
1. The Electromigration and Failure Behaviour in Layered Tungsten Via Structures
Elliott, L. J. ; Spooner, T. ; Rose, J. H. ; Shuman, R.
Pub. info.: Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A..  pp.459-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 391
2.

Conference Proceedings
Conference Proceedings
2. BEOL lithography for early development at the 65-nm node
DellaGuardia, R. ; Kwong, R.W. ; Li, W. ; Lawson, P. ; Burkhardt, M. ; Grauer, I.C. ; Wu, Q. ; Angyal, M. ; Hichri, H. ; Melville, I. ; Kumar, K. ; Lin, Y. ; Holmes, S.J. ; Varanasi, R. ; Spooner, T. ; McHerron, D.
Pub. info.: Optical Microlithography XVII.  pp.980-987,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5377