1.

Conference Proceedings
Conference Proceedings
1. A Quantitative Correlation Between Inversion-Layer Mobility and Si/SiO2 Interface Roughness
Fang, S.J. ; Lin, H.C. ; Snyder, J.P. ; Helms, C.R. ; Yamanaka, T.
Pub. info.: The physics and chemistry of SiO[2] and the Si-SiO[2] interface-3, 1996 : proceedings of the Third International Symposium on the Physics and Chemistry of SiO[2] and the Si-SiO[2] Interface.  pp.329-337,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-1
2.

Technical Paper
Technical Paper
2. Uncertainty Propagation for Selected Analytical Milling Stability Limit Analyses.
Duncan, G.S. ; Kurdi, M.H. ; Schmitz, T.L. ; Snyder, J.P.
Pub. info.: S.M.E. technical paper.  2006.  Dearborn, Mich..  Society of Manufacturing Engineers
Title of ser.: SME Technical Paper : TP
Ser. no.: 2006
3.

Conference Proceedings
Conference Proceedings
3. Limits of strong phase-shift patterning for device research
Fritze, M. ; Mallen, R.D. ; Wheeler, B. ; Yost, D. ; Snyder, J.P. ; Kasprowicz, B.S. ; Eynon, B.G. ; Liu, H.-Y.
Pub. info.: Optical Microlithography XVI.  Part One  pp.327-343,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5040
4.

Technical Paper
Technical Paper
4. A New Stable Speed Test Apparatus for Milling.
Snyder, J.P. ; Pratt, J.R. ; Smith, S. ; Davies, M.A.
Pub. info.: SME technical paper.  2001.  Society of Manufacturing Engineers