1.

Conference Proceedings
Conference Proceedings
1. The study of phase angle effects to wafer process window using 193-nm EAPSM in a 300-mm wafer manufacturing environment
Chou, W.Y. ; Yen, S.M. ; Wu, J.K. ; Shieh, W.B. ; Chuang, M. ; Fan, G. ; Tseng, C.C. ; Hughes, G.P. ; MacDonald, S.S. ; Holiday, C. ; Chen, G.
Pub. info.: Photomask and Next-Generation Lithography Mask Technology XI.  pp.615-623,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5446
2.

Conference Proceedings
Conference Proceedings
2. Automated defect severity analysis for binary and PSM mask defects
Cai, L. ; Chen, J.-H. ; Tu, L.-H. ; Chu, B. ; Chen, N. ; Fang, T.Y. ; Shieh, W.B.
Pub. info.: 22nd Annual BACUS Symposium on Photomask Technology.  Part One  pp.253-262,  2002.  Bellingham, WA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4889
3.

Conference Proceedings
Conference Proceedings
3. Correlating reticle pinhole defects to wafer printability for the 90-nm node lithography using advanced RET
Shieh, W.B. ; Chou, W. ; Yang, C.-H. ; Wu, J.K. ; Chen, N. ; Yen, S.M. ; Hsu, T. ; Tuan, S. ; Chang, D. ; Rudzinski, M.W. ; Wang, L. ; Son, K.
Pub. info.: Optical Microlithography XVII.  pp.1047-1058,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5377