1.

Conference Proceedings
Conference Proceedings
1. STABILITY OF SPUTTER DEPOSITED A1-Cu BILAYERS ON SiO2
Nandan, R. ; Murarka, S. P. ; Pant, A. ; Shepard, C. ; Lanford, W. A.
Pub. info.: Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A..  pp.929-934,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 260
2.

Conference Proceedings
Conference Proceedings
2. INTERACTIONS OF COPPER WITH INTERLAYER DIELECTRICS AND ADHESION PROMOTERS/DIFFUSION BARRIERS
Arcot, B.. ; Shy, Y.T. ; Murarka, S.P. ; Shepard, C. ; Lanford, W.A.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.27-32,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203