1.

Conference Proceedings
Conference Proceedings
1. Effects of Dielectric Thermal Expansion and Elastic Modulus on the Stress and Defromation Fields in Copper Interconnects
Shen, Y.-L.
Pub. info.: Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A..  pp.351-356,  2006.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 914
2.

Conference Proceedings
Conference Proceedings
2. Constitutive Response of Passivated Copper Films: Experiments and Analyses
Shen, Y.-L. ; Ramamurty, U.
Pub. info.: Thin films : stresses and mechanical properties IX : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A..  pp.257-262,  2002.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 695
3.

Conference Proceedings
Conference Proceedings
3. Effects of Inclusions and Porosity on the Indentation Response
Ege, E.S. ; Shen, Y.-L.
Pub. info.: Surface engineering 2002 - synthesis, characterization and applications : symposium held December 2-5, 2002, Boston, Massachusetts, U.S.A..  pp.501-506,  2003.  Warrendale, Penn.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 750
4.

Conference Proceedings
Conference Proceedings
4. An Atomistic View of Interface-Mediated Dislocation Plasticity In Thin Metal Films
Ege, E.S. ; Shen, Y.-L.
Pub. info.: Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A..  pp.41-46,  2002.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 795
5.

Conference Proceedings
Conference Proceedings
5. Atomistic Simulations of Dislocation-Interface Interactions in Thin Films
Leger, R.W. ; Shen, Y.-L.
Pub. info.: Nanoscale materials and modeling -- relations among processing, microstructure and mechanical properties : symposium held April 13-16, 2004, San Francisco, California, U.S.A..  pp.209-214,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 821
6.

Conference Proceedings
Conference Proceedings
6. Thermomechanical Stresses in Copper Interconnect/Low-k Dielectric Systems
Shen, Y.-L. ; Ege, E.S.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.333-338,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812
7.

Conference Proceedings
Conference Proceedings
7. Plasma assisted MBE growth and characterizations of GaN
Tu, L.-W. ; Lee, K.-H. ; Lai, C.-M. ; Hsu, M.-K. ; Chen, W.-S. ; Liu, C.-S. ; Lo, I. ; Tsai, J.-K. ; Ho, P.-C. ; Hsieh, K.-Y. ; Huang, C.-H ; Shen, Y.-L.
Pub. info.: Light-Emitting Diodes: Research, Manufacturing, and Applications VI.  pp.94-101,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4641