1.

Conference Proceedings
Conference Proceedings
1. Optimizing Sputtered TiN Arc Film Properties for Lithography of Sub-0.25 ｦﾌm Interconnect
Sengupta, S. S. ; Baker, D. ; Sethi, S. ; Bothra, S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.539-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514
2.

Conference Proceedings
Conference Proceedings
2. Er-doped GaAs for high speed photoconductor applications
Gupta, S. ; Sethi, S. ; Bhattacharya, P. K. ; Williamson, S.
Pub. info.: Rare earth doped semiconductors : symposium held April 13-15, 1993, San Francisco, California, U.S.A..  pp.347-,  1993.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 301
3.

Conference Proceedings
Conference Proceedings
3. Optimal Selection of Nanofiltration Configurations: Conventional versus Hybrid Systems
Sethi, S. ; Wiesner, M.
Pub. info.: AIChE NATIONAL MEETING - MARCH 9-13, 1997 - HOUSTON, TX.  1997.  New York.  American Institute of Chemical Engineers
Title of ser.: AIChE meeting [papers]
Ser. no.: 1997
4.

Conference Proceedings
Conference Proceedings
4. Dielectric CMP Planarization Considerations for Deep Sub-Micron Multilevel Interconnect Processes
Weling, M. ; Bothra, S. ; Qian, L. ; Sethi, S. ; Pramanik, D.
Pub. info.: Proceedings of the First International Symposium on Chemical Mechanical Planarization.  pp.197-205,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-22
5.

Technical Paper
Technical Paper
5. Optimization of Automotive Carpet Fabric for Enhanced Abrasion Resistance for Low Cost Car.
Pandey, K. ; Sethi, S.
Pub. info.: 2011 SAE world congress : technical paper.  2011.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2011