1.

Conference Proceedings
Conference Proceedings
1. Improved Al-Via Fill Process Technology for Sub-0.25 ｦﾌm Interconnect
Sengupta, S. S. ; Narasimhan, M. ; Lee, S. ; Abburi, M. ; Yao, G.
Pub. info.: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.437-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 564
2.

Conference Proceedings
Conference Proceedings
2. Optimizing Sputtered TiN Arc Film Properties for Lithography of Sub-0.25 ｦﾌm Interconnect
Sengupta, S. S. ; Baker, D. ; Sethi, S. ; Bothra, S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.539-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514