1.

Conference Proceedings
Conference Proceedings
1. Thickness Effect On Nickel Silicide Formation And Thermal Stability For Ultra Shallow Junction CMOS
Zhao, F.F. ; Shen, Z.X. ; Zheng, J.Z. ; Gao, W.Z. ; Osipowicz, T. ; Pang, C.H. ; Lee, P.S. ; See, A.K.
Pub. info.: Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A..  pp.41-46,  2002.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 716
2.

Conference Proceedings
Conference Proceedings
2. Backside Copper Contamination Issues In CMOS Process Integration - A Case Study
Prasad, K. ; Tee, K. ; Chan, L. ; See, A.K.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D8.4-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
3.

Conference Proceedings
Conference Proceedings
3. Direct Formation of C54 Phase on the Basis of C40 TiSi2 and Its Applications in Deep Sub-Micron Technology
Chen, S.Y. ; Shen, Z.X. ; Xu, S.Y. ; See, A.K. ; Chan, L.H. ; Li, W.S.
Pub. info.: Gate stack and silicide issues in silicon processing II : symposium held April 17-19, 2001, San Francisco, California, U.S.A..  2002.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 670
4.

Conference Proceedings
Conference Proceedings
4. Copper Contamination Issues in MOS Integrated Circuits
Prasad, K. ; Tee, K.C. ; Chan, L. ; See, A.K.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.149-159,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-27