1.

Conference Proceedings
Conference Proceedings
1. Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies
S.N. Farrens ; M. Gabriel
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.175-180,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
2.

Conference Proceedings
Conference Proceedings
2. ANALYSIS OF BOND CHARACTERISTICS IN SIDIRECT-BONDED MATERIALS
S.N. Farrens ; B.E. Roberds ; J.K. Smith ; C.B. Hunt
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.81-95,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
3.

Conference Proceedings
Conference Proceedings
3. LOW TEMPERATURE WAFER BONDING OF SURFACES USING A REACTIVE SPUTTERED OXIDE
J.A. Folta ; C.B. Hunt ; S.N. Farrens
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.107-114,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
4.

Conference Proceedings
Conference Proceedings
4. LOW TEMPERATURE SILICON DIRECT BONDING
B.B. Roberds ; S.N. Farrens
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.240-248,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
5.

Conference Proceedings
Conference Proceedings
5. THE EFFECTS OF PROCESS-INDUCED DEFECTS ON THE CHEMICAL SELECTIVITY OF HIGHLY-DOPED BORON ETCHSTOPS
C.A. Desmond ; C.B. Hunt ; S.N. Farrens
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.423-432,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29