1.

Conference Proceedings
Conference Proceedings
1. The Low Leakage Current Density of MIS with SiO₂ Film Made by ICP-CVD
Y. Lu ; S. Tsai ; M. Hon
Pub. info.: Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing.  pp.261-266,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(1)
2.

Conference Proceedings
Conference Proceedings
2. Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization
R. Jia ; Y. Wang ; Z. Wang ; S. Tsai ; J. Dma ; D. Mao ; L. Karuppiah ; L. Chen
Pub. info.: Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA.  pp.125-134,  2006.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(11)
3.

Conference Proceedings
Conference Proceedings
3. The Strain Effects on Flexible a-Si:H TFTs
L. Teng ; P. Liu ; S. Tsai ; I. Peng ; Y. Chou
Pub. info.: Thin Film Transistors 9.  pp.333-337,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(9)
4.

Conference Proceedings
Conference Proceedings
4. Effect of Passivation Layer on the Reliability of Flexible a-Si:H TFTs
Y. Chou ; P. Liu ; S. Tsai ; C. Su ; I. Peng
Pub. info.: Thin Film Transistors 9.  pp.339-343,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(9)
5.

Technical Paper
Technical Paper
5. Development of a Prediction Tool for Strength and Life of Composites Structures
S. Sihn ; J. Park ; S. Tsai
Pub. info.: AIAA meeting papers on disc.  2008.  Reno, Nevada.  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Ser. no.: 2008