1.

Conference Proceedings
Conference Proceedings
1. The Effect of Process Parameters on CVD Cu Seed Layer Deposition on Ru and Ta Under-layer
H. Kim ; Y. Kojima ; N. Yoshii ; H. Sato ; S. Hosaka
Pub. info.: Fundamental Gas-Phase and Surface Chemistry of Vapor-Phase Materials Processing 3.  pp.157-165,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(7)
2.

Conference Proceedings
Conference Proceedings
2. Controlled Structure of Zinc Oxide by Means of Side Flow Type MOCVD
N. Yoshii ; A. Nakamura ; S. Hosaka ; J. Temmyo
Pub. info.: ZnO based thin films, nano-wires, and nano-belts for photonic and electronic devices and sensors.  pp.3-11,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(12)
3.

Conference Proceedings
Conference Proceedings
3. Pattern Transfer of 23-Nm-Diameter Block Copolymer Self-Assembled Nanodots Using CF4 Etching with Carbon Hard Mask (CHM) as Mask
M. Huda ; J. Liu ; Z. Bin Mohamad ; Y. Yin ; S. Hosaka
Pub. info.: Nanotechnology applications in energy and environment : selected peer reviewed papers from the proceedings of Symposium on Nanotechnology Applications in Energy and Environment 2012 (NAEE2012) 20-21 September 2012, Bandung, Indonesia.  pp.133-136,  2013.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 737
4.

Conference Proceedings
Conference Proceedings
4. Adhesion and Cu Diffusion Barrier Properties of a MnOx Barrier Layer Formed with Thermal MOCVD
Koji Neishi ; Vijay Kumar Dixit ; S. Aki ; Junichi Koike ; K. Matsumoto ; H. Sato ; H. Itoh ; S. Hosaka
Pub. info.: Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2009 : symposium held April 14-17, 2009, San Francisco, California, U.S.A..  pp.99-104,  2009.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 1156