1.

Conference Proceedings
Conference Proceedings
1. Incremental ring-core cutting around an interferometric strain/slope rosette for residual stress measurement
Ren,W. ; Li,K.Y.
Pub. info.: Third International Conference on Experimental Mechanics : 15-17 October, 2001, Beijing China.  pp.139-142,  2001.  Bellingham, Washington.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4537
2.

Conference Proceedings
Conference Proceedings
2. Application of image processing on the online measurement of dimensions in the section of the hot-rolled section steel
Ren,W. ; Sun,P. ; Wang,Y. ; Zhu,H.
Pub. info.: Applications of digital image processing XIX : 7-9 August 1996, Denver, Colorado.  pp.603-608,  1996.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2847
3.

Conference Proceedings
Conference Proceedings
3. Uniaxial stress dependence of the piezoelectric properties of lead zirconate titanate ceramics
Yang,G. ; Liu,S.-F. ; Ren,W. ; Mukherjee,B.K.
Pub. info.: Smart structures and materials 2000 : Active materials : behavior and mechanics : 6-9 March, 2000, Newport Beach, USA.  pp.103-113,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3992
4.

Conference Proceedings
Conference Proceedings
4. Nonlinear properties of piezoelectric ceramics
Mukherjee,B.K. ; Ren,W. ; Liu,S.-F. ; Masys,A.J. ; Yang,G.
Pub. info.: Smart structures and materials 2001 : Active materials : behavior and mechanics : 5-8 March, 2001, Newport Beach, USA.  pp.41-54,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4333
5.

Conference Proceedings
Conference Proceedings
5. Reliability study of microelectronic packaging assemblies by a multiaxial submicron fatigue tester(Invited Paper)
Liu,S. ; Lu,M. ; Qian,Z. ; Ren,W.
Pub. info.: Microelectronic Packaging and Laser Processing.  pp.32-39,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3184