1.

Conference Proceedings
Conference Proceedings
1. Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges
Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V. ; Haxaire, K. ; Mourier, T. ; Haumesser, P.H ; Maitrejean, S. ; Simon, J. ; Chabli, A. ; Passemard, G. ; Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.186-205,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors
Remiat, B. ; Fusalba, F. ; Maury, P. ; Jousseaume, V. ; Lecornec, C. ; Gaillard, F. ; Durand, J.
Pub. info.: Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium.  pp.120-125,  2002.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-22
3.

Conference Proceedings
Conference Proceedings
3. Mechanical Properties of Porous MSQ Films: Impact of the Porogen Loading and Matrix Crosslinking.
Ciaramella, F. ; Jousseaume, V. ; Maitrejean, S. ; Remiat, B. ; Verdier, M. ; Passemard, G.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.17-22,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863