1.

Conference Proceedings

Conference Proceedings
Nayar, V. ; Carline, R.T. ; Newey, J. ; Pidduck, A.J. ; Reeves, C. ; Russell, J. ; Williams, G. ; Quinn, C. ; Nevin, A. ; Blackstone, S. ; Feindt, S.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.544-551,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings

Conference Proceedings
Papakonstantinou, P. ; Somasundram, K. ; Cao, X. ; Quinn, C. ; Yallup, K. ; Nevin, W.A. ; Blackstone, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.178-186,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings

Conference Proceedings
McDonnell, B. ; Blackstone, S. ; Wilson, R. ; Quinn, C. ; Yallup, K.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.535-545,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7