1.

Conference Proceedings
Conference Proceedings
1. Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M. ; Katzer, D. ; Wiemer, M. ; Bagdahn, J.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.613-623,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
2.

Conference Proceedings
Conference Proceedings
2. The Influence of Sharp Notches on the Strength of Directly Bonded Components
Bagdahn, J. ; Katzer, D. ; Petzold, M. ; Wiemer, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.285-290,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
3.

Conference Proceedings
Conference Proceedings
3. Lifetime Properties of Wafer-Bonded Components under Static and Cyclic Loading
Bagdahn, J. ; Petzold, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.129-136,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
4.

Conference Proceedings
Conference Proceedings
4. Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test
Bagdahn, J. ; Ploessl, A. ; Wiemer, M. ; Petzold, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.218-223,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
5.

Conference Proceedings
Conference Proceedings
5. Characterisation of Directly Bonded Silicon Wafers by Means of the Double Cantilever Crack Opening Method
Bagdahn, J. ; Petzold, M. ; Reiche, M. ; Gutjahr, K.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.291-298,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
6.

Conference Proceedings
Conference Proceedings
6. The Effect of a Plasma Pretreatment on the Si/Si Bonding Behaviour
Reiche, M. ; Gutjahr, K. ; Stolze, D. ; Burczyk, D. ; Petzold, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.437-444,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
7.

Conference Proceedings
Conference Proceedings
7. Interface Strength Characterization of Bonded Wafers
Petzold, M. ; Petersilge, M. ; Abe, T. ; Reiche, M.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.380-389,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
8.

Technical Paper
Technical Paper
8. Analysis of the Metering Behavior and the Energy Efficiency of a Dosing Pump.
Petzold, M. ; Weber, J.
Pub. info.: 2012 Commercial Vehicle Engineering Congress and Exhibition : SAE technical paper.  2012.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2012