1.

Conference Proceedings
Conference Proceedings
1. Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges
Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V. ; Haxaire, K. ; Mourier, T. ; Haumesser, P.H ; Maitrejean, S. ; Simon, J. ; Chabli, A. ; Passemard, G. ; Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.186-205,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. SILK SURFACE CHEMICAL TREATMENT
Beverina, A. ; Maisonobe, J. C. ; Lardin, T. ; Ermolieff, A. ; Passemard, G. ; Tardif, F.
Pub. info.: Cleaning technology in semiconductor device manufacturing : proceedings of the sixth international symposium.  pp.320-326,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-36
3.

Conference Proceedings
Conference Proceedings
3. ECD Seed Copper Layer for Seed Enhancement in Advanced Interconnects
Haumesser, P.H. ; Da Silva, S. ; Cordeau, M. ; Avale, X. ; Pallet, O. ; Mourier, T. ; Passemard, G. ; Baskaran, R. ; Ritzdorf, T.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.6-15,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-10
4.

Conference Proceedings
Conference Proceedings
4. Plasma Treatments and PECVD Dielectric Deposition Impact on Porous SiOC
Jousseaume, V. ; Maury, P. ; Le Cornec, C. ; Zenasni, A. ; Remiat, B ; Fusalba, F. ; Passemard, G.
Pub. info.: Silicon nitride, silicon dioxide thin insulating films, and other emerging dieletrics VIII : proceedings of the international symposium.  pp.97-112,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-01
5.

Conference Proceedings
Conference Proceedings
5. Study of Work Function of CVD WSix Thin Film on High-k Dielectric
Maitrejean, S. ; Allegret, S. ; Fillot, F. ; Farjot, T. ; Guillaumot, B. ; Passemard, G.
Pub. info.: Fundamentals of novel oxide/semiconductor interfaces : symposium held December 1-4, 2003, Boston, Massachusetts, U.S.A..  pp.285-290,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 786
6.

Conference Proceedings
Conference Proceedings
6. Study of Metal Gate Work Function Modulation Using Plasma and SiH4 Treated TiN Thin Films
Fillot, F. ; Maitrejean, S. ; Farjot, T. ; Guillaumot, B. ; Chenevier, B. ; Passemard, G.
Pub. info.: Fundamentals of novel oxide/semiconductor interfaces : symposium held December 1-4, 2003, Boston, Massachusetts, U.S.A..  pp.259-266,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 786
7.

Conference Proceedings
Conference Proceedings
7. Mechanical Properties of Porous MSQ Films: Impact of the Porogen Loading and Matrix Crosslinking.
Ciaramella, F. ; Jousseaume, V. ; Maitrejean, S. ; Remiat, B. ; Verdier, M. ; Passemard, G.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.17-22,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863
8.

Conference Proceedings
Conference Proceedings
8. Ultra Low-k PECVD Porogen Approach: Matrix Precursors Comparison and Porogen Removal Treatment Study
Favennec, L. ; Jousseaume, V. ; Rouessac, V. ; Durand, J. ; Passemard, G.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.49-54,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863
9.

Conference Proceedings
Conference Proceedings
9. Sol-Gel Derived Silica Layers For Low-k Dielectrics Applications
Acosta, S. ; Ayral, A. ; Guizard, C. ; Lecornec, C. ; Passemard, G. ; Moussavi, M.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D5.26-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612