1.

Conference Proceedings
Conference Proceedings
1. Low Temperature Bonding of PECVD Silicon Dioxide Layers
P.T. Baine ; M. Bain ; D.W. McNeill ; H.S. Gamble ; M. Armstrong
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.165-173,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
2.

Conference Proceedings
Conference Proceedings
2. Germanium Bonding to AL2O3
P.T. Baine ; H. Gamble ; B. Armstrong ; S.J.N. Mitchell ; D. McNeill
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.407-414,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)