1.

Conference Proceedings
Conference Proceedings
1. Packaging for 3D optoelectronic stacked processors
Marchand,P.J. ; Zheng,X. ; Huang,D. ; Ozguz,V.H. ; Esener,S.C.
Pub. info.: Optoelectronic integrated circuits and packaging III : 28-29 January 1999, San Jose, California.  pp.142-147,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3631
2.

Conference Proceedings
Conference Proceedings
2. Alignment tolerancing of free-space MCM-to-MCM optical interconnects
Zaleta,D.E. ; Patra,S.K. ; Ozguz,V.H. ; Ma,J. ; Lee,S.H.
Pub. info.: Optoelectronic Packaging.  pp.91-108,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2691
3.

Conference Proceedings
Conference Proceedings
3. Parallel three-dimensional free-space optical interconnection for an optoelectronic processor
Li,G. ; Huang,D. ; Yuceturk,E. ; Esener,S.C. ; Ozguz,V.H. ; Liu,Y.
Pub. info.: Photonic Devices and Algorithms for Computing III.  pp.19-29,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4470
4.

Conference Proceedings
Conference Proceedings
4. Free-space optical interconnection of 3D optoelectronic VLSI chip stacks
Huang,D. ; Yuceturk,E. ; Li,G. ; Wang,M.M. ; Zheng,X. ; Marchand,P.J. ; Esener,S.C. ; Liu,Y. ; Ozguz,V.H.
Pub. info.: Optoelectronic Interconnects VIII.  pp.95-104,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4292