1.
|
Conference Proceedings
|
Chand,N. ; Osenbach,J.W. ; Evanosky,T.L. ; Comizzoli,R.B. ; Tsang,W.
Pub. info.: |
Laser Diode Chip and Packaging Technology. pp.46-58, 1996. Bellingham, Wash.. SPIE-The International Society for Optical Engineering |
Title of ser.: |
Proceedings of SPIE - the International Society for Optical Engineering |
Ser. no.: |
2610 |
|
2.
|
Conference Proceedings
|
Osenbach,J.W. ; Evanosky,T.L. ; Phatak,S.B. ; Comizzoli,R.B. ; Chand,N.
Pub. info.: |
Laser Diode Chip and Packaging Technology. pp.117-126, 1996. Bellingham, Wash.. SPIE-The International Society for Optical Engineering |
Title of ser.: |
Proceedings of SPIE - the International Society for Optical Engineering |
Ser. no.: |
2610 |
|