1.

Conference Proceedings
Conference Proceedings
1. Reliability of FBGA(Fine Pitch BGA)Package using PCB Substrate
Ahn,E.C. ; Cho,T.J. ; Hyun,H.S. ; Chung,T.G. ; Oh,S.Y.
Pub. info.: Proceedings : 1999 International Symposium on Microelectronics : 26-28 October 1999, Chicago, Illinois.  pp.599-604,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3906
2.

Conference Proceedings
Conference Proceedings
2. Development of Thermal Solution for High Power Flip Chip CPU Package
Kwon,H.K. ; Baek,J.H. ; Chun,J.W. ; Kim,M.H. ; Lee,T.K. ; Oh,S.Y. ; Ro,Y.H.
Pub. info.: 2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA.  pp.313-319,  2000.  Reston, VA, Bellingham, Wash..  IMAPS — SPIE-The International Society for Optical
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4217
3.

Conference Proceedings
Conference Proceedings
3. New Multichip Package Using a Si-Substrate
Lee,Y.M. ; Jang,D.H. ; Sun,Y.B. ; Oh,S.Y.
Pub. info.: Proceedings : 1995 International Symposium on Microelectronics, October 24-26, 1995, Los Angels Convention Center, Los Angeles, California.  pp.337-341,  1995.  Reston, VA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2649
4.

Conference Proceedings
Conference Proceedings
4. Developments of optimum flip-chip bonding process
Jang,D.H. ; Kang,S.K. ; Lee,Y.M. ; Oh,S.Y.
Pub. info.: Microelectronic Packaging and Laser Processing.  pp.5-12,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3184