1.

Conference Proceedings
Conference Proceedings
1. TAILORED MICROSTRUCTURES TO CONTROL INTERFACIAL TOUGHNESS
Oh, T.S. ; Cannon, R.M. ; Rotichie, R.O.
Pub. info.: Thin films : stresses and mechanical properties : symposium held November 28-30, 1988, Boston, Massachusetts, U.S.A..  pp.219-224,  1989.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 130
2.

Conference Proceedings
Conference Proceedings
2. *ADHESION, REACTION AND STABILITY OF METAL/POLYIMIDE INTERFACES
Kim, J. ; Kowalczyk, S.P. ; Kim, Y.H. ; Chou, N.J. ; Oh, T.S.
Pub. info.: Advanced electronic packaging materials : symposium held November 27-29, 1989, Boston, Massachusetts, U.S.A..  pp.137-146,  1990.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 167
3.

Conference Proceedings
Conference Proceedings
3. EFFECT OF RF SPUTTERING ON T/H SUSCEPTIBILITY OF Cr/POLYIMIDE ADHESION
Kim, D.G. ; Oh, T.S. ; Molis, S. ; Kowalczyk, S. ; Kim, J.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.65-70,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
4.

Conference Proceedings
Conference Proceedings
4. Ferroelectric Characteristics of SrxBi2.4Ta2O9 Thin Films and Electrical Properties of the Pt/SrxBi2.4Ta2O9/TiO2/Si Structure
Choi, J.H. ; Oh, T.S.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.477-480,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452
5.

Conference Proceedings
Conference Proceedings
5. Electrodeposition of Bi2Te3 for Nanowire Application
Lee, Y.H. ; Lee, K.Y. ; Bae, J.S. ; Lee, J.H. ; Byun, J.Y. ; Hyun, D.B. ; Oh, T.S.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.377-380,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452
6.

Conference Proceedings
Conference Proceedings
6. Reaction between Sn-In Solder and Under Bump Metallurgy
Choi, J.H. ; Jung, B.Y. ; Jun, S.W. ; Kim, Y.H. ; Oh, T.S.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.401-404,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452