1.

Conference Proceedings
Conference Proceedings
1. Aggregate Behavior in Metal CMP Slurries
Tamboli, D.C. ; Desai, V.H. ; Dogariu, A. ; Sundaram, K.B. ; Maury, A. ; Obeng, Y.
Pub. info.: Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing.  pp.206-217,  1998.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-7
2.

Conference Proceedings
Conference Proceedings
2. The How's and Why's of Characterizing Particle Size Distributions in CMP Slurries
Anthony, L. ; Miner, J. ; Baker, M. ; Lai, W. ; Sowell, J. ; Maury, A. ; Obeng, Y.
Pub. info.: Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing.  pp.181-196,  1998.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-7
3.

Conference Proceedings
Conference Proceedings
3. Characterization of Segmented Polyurethane Surface Domains as related to Chemical Mechanical Polishing (CMP)
Ramsdell, J. ; Seal, S. ; Obeng, Y. ; Decker, M. A. ; Stevie, F. A.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.32-45,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1
4.

Conference Proceedings
Conference Proceedings
4. Characterization of 'In-Process' Degradation of Polyurethane CMP Pads
Obeng, Y. ; Ramadeil, J. ; Machinaky, S. ; Lu, H. ; LI, I. ; Forsthoefei, K.M. ; Richardson, K. ; Seal, S.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.13-25,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1
5.

Conference Proceedings
Conference Proceedings
5. Chemical-mechanical Planarization of Copper: Role of Oxidants and Inhibitors
Kuiry, S. ; Deshpande, S. ; Obeng, Y. ; Seal, S.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.52-60,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
6.

Conference Proceedings
Conference Proceedings
6. Performance-Surface Characteristics of psiloQuest's Application Specifte Pads for Chemical Mechanical Planarization
Obeng, Y. ; Deshpande, S. ; Kuiry, S.C. ; Dakshinamurthy, S. ; Chamma, K. ; Vaidyanathan, R. ; Richardson, K. ; Seal., S.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.126-137,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
7.

Conference Proceedings
Conference Proceedings
7. Impact of CMP Consumables on Copper Metallization Reliability
Obeng, Y.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.155-164,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21