1.

Conference Proceedings
Conference Proceedings
1. Reliability Evaluation of CSP Electronic Devices Package
Koguchi, Hideo ; Sasaki, Chie ; Nishida, Kazuto
Pub. info.: Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001.  pp.429-433,  2001.  Washington, DC.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4587
2.

Conference Proceedings
Conference Proceedings
2. High Density Packaging using Flip Chip Technology in Mobile Communicaton Equipment
Nishida, Kazuto ; Shimizu, Kazumichi ; Yui, Takashi ; Honma, Hajime ; Matsumura, Nobuya ; Okamoto, Izumi ; Abe Kouji ; Kouzou, Takada ; Ema, Tomiyo ; Koguchi, Hideo ; Sasaki, Chie
Pub. info.: Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001.  pp.272-277,  2001.  Washington, DC.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4587
3.

Conference Proceedings
Conference Proceedings
3. Ultra-Thin & High-Density Packaging Using Both Sides Filip Chip Technology
Nishida, Kazuto ; Shimiz, Kazumichi ; Yoshino, Michiro ; Yagi, Yoshihiko ; Koguchi, Hideo ; Sasaki, Chie
Pub. info.: Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO.  pp.366-371,  2002.  Washington, DC.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4931
4.

Conference Proceedings
Conference Proceedings
4. Flip Chip Bonding Technology for Molded Interconnect Device
Yagi, Yoshihiko ; Yoshino, Michiro ; Nakamura, Kojiro ; Nishida, Kazuto ; Kakino, Manabu ; Hirose, Takayuki ; Harazono, Fumikazu
Pub. info.: Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA.  pp.256-261,  2003.  Reston, Va..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5288