1.

Conference Proceedings
Conference Proceedings
1. New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers
B. Aspar ; C. Lagahe-Blanchard ; N. Sousbie ; J. Margail ; H. Moriceau
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.79-90,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
2.

Conference Proceedings
Conference Proceedings
2. Evolution of Lattice Strain in Hydrogen-Implanted Silicon Prior to Layer Splitting: An X-Ray Scattering Study
L. Capello ; F. Rieutord ; A. Tauzin ; F. Mazen ; N. Sousbie
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.119-127,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)