1.

Conference Proceedings
Conference Proceedings
1. Pulsed Electrodeposition of Copper Metallization from an Alkali Bath
Krishnamoorthy, A. ; Lee, C.Y. ; Duquette, D.J. ; Murarka, S.P.
Pub. info.: Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability.  pp.185-194,  1998.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-6
2.

Conference Proceedings
Conference Proceedings
2. Glycerol-Based Slurry for Polyimide CMP
Permana, D. ; Murarka, S.P. ; Lee, M.G. ; Beilin, S.I.
Pub. info.: Proceedings of the First International Symposium on Chemical Mechanical Planarization.  pp.206-218,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-22
3.

Conference Proceedings
Conference Proceedings
3. INTERACTIONS OF COPPER WITH INTERLAYER DIELECTRICS AND ADHESION PROMOTERS/DIFFUSION BARRIERS
Arcot, B.. ; Shy, Y.T. ; Murarka, S.P. ; Shepard, C. ; Lanford, W.A.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.27-32,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
4.

Conference Proceedings
Conference Proceedings
4. Characterization of Cu-Al Alloy/SiO2 Interface Microstructure
Wang, P.-I. ; Murarka, S.P. ; Yang, G.-R. ; Barnat, E. ; Lu, T.-M. ; Chen, Y.-C. ; Li, X. ; Ranjan, K.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D10.5/G7.5-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
5.

Conference Proceedings
Conference Proceedings
5. Characterization of Cu-Al Alloy/SiO2 Interface Microstructure
Wang, Pei-I. ; Murarka, S.P. ; Yang, G-R. ; Barnat, E. ; Lu, T-M. ; Chen, Y-C. ; Li, Xiang ; Rajan, K.
Pub. info.: Polycrystalline metal and magnetic thin films-2000 : symposium held April 25-27, 2000, San Francisco, California, U.S.A..  pp.G7.5/D10.5-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 615
6.

Conference Proceedings
Conference Proceedings
6. Optimization of the Chemical Mechanical Planarization Process to Build Multilevel Copper Interconnection Structures
Murarka, S.P.
Pub. info.: Proceedings of the First International Symposium on Chemical Mechanical Planarization.  pp.121-136,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-22