1.

Conference Proceedings
Conference Proceedings
1. Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges
Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V. ; Haxaire, K. ; Mourier, T. ; Haumesser, P.H ; Maitrejean, S. ; Simon, J. ; Chabli, A. ; Passemard, G. ; Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.186-205,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. ECD Seed Copper Layer for Seed Enhancement in Advanced Interconnects
Haumesser, P.H. ; Da Silva, S. ; Cordeau, M. ; Avale, X. ; Pallet, O. ; Mourier, T. ; Passemard, G. ; Baskaran, R. ; Ritzdorf, T.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.6-15,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-10
3.

Conference Proceedings
Conference Proceedings
3. Structural Comparison Between Cu(hfac)(VTMS) and Cu(hfac)(MHY): An Answer to Differences in Copper Film Deposition
Joulaud, M. ; Omnes, L. ; Mourier, T. ; Mayer, D. ; Doppelt, P.
Pub. info.: Chemical vapor deposition XVI and EUROCVD 14 : proceedings of the international symposium.  pp.1268-1274,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-8