1.

Conference Proceedings
Conference Proceedings
1. Improvement of Solution Type Plasma Spraying Process
Futamata, M. ; Gai, X.H. ; Mizumoto, T. ; Nakanishi, K.
Pub. info.: New frontiers of processing and engineering in advanced materials : proceedings of the International Conference on New Frontiers of Process Scinence and Engineering in Advanced Materials : The 14th Iketani Conference, November, 24-26, 2004, held in Kyoto, Japan.  pp.505-510,  2005.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 502
2.

Conference Proceedings
Conference Proceedings
2. Contact Angle Measurement of Wafer Surfaces for Integrating Laser Diode and Optical Isolator by Wafer Bonding
Yokoi, H. ; Mizumoto, T. ; Shimizu, M. ; Waniishi, T. ; Futakuchi, N. ; Kaida, N. ; Nakano, Y.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.311-317,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings
Conference Proceedings
3. Integration of optical isolators and semiconductor lasers by wafer bonding (Invited Paper) [6352-90]
Mizumoto, T. ; Sakurai, K. ; Shoji, Y. ; Saito, H.
Pub. info.: Optoelectronic materials and devices : 5-7 September, 2006, Gwangju, South Korea.  pp.63522B-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6352
4.

Conference Proceedings
Conference Proceedings
4. Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding
Yokoi, H. ; Mizumoto, T.
Pub. info.: High-density magnetic recording and integrated magneto-optics, materials and devices : symposium held April 12-16, 1998, San Francisco, California, U.S..  pp.469-,  1998.  Warrendale, Penn.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 517
5.

Conference Proceedings
Conference Proceedings
5. TE-TM Mode Conversion Optical Isolator Fabricated by Wafer Bonding
Yokoi, H. ; Mizumoto, T. ; Iwasaki, H.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.130-136,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
6.

Conference Proceedings
Conference Proceedings
6. Effects of Casting Defects and Microstructure on Fatigue Properties of Cast Ag-Pd-Cu-Au-Zn Alloy for Dental Applications
Mizumoto, T. ; Niinomi, M. ; Akahori, T. ; Fukui, H.
Pub. info.: THERMEC '2003 : International Conference on Processing & Manufacturing of Advanced Materials, July 7-11, 2003, Leganés, Madrid, Spain.  pp.3207-3212,  2003.  Zuerich-Uetikon, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 426-432
7.

Conference Proceedings
Conference Proceedings
7. Selective area growth of magnetic garnet crystals by liquid-phase epitaxy
Yokoi, H. ; Mizumoto, T.
Pub. info.: Substrate engineering - paving the way to epitaxy : sympoisum held November 29-December 3, 1999, Boston, Massachusetts, U.S.A..  pp.O6.9.1-,  2000.  Warrendale, Pa..  MRS-Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 587